Packaging Automation Benchmark Study, Part 1: Change is constant
As market trends change, packaging pros and their suppliers are forced to become more agile and responsive to customer needs. This Automation in Packaging Benchmark Study quantifies the trends, needs and opportunities for all.
By Control Engineering Staff -- Control Engineering, 4/1/2008
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Many people might argue that packaging is not an industry in and of itself. Indeed, packaging is a function of virtually all businesses selling non-commodity physical products. One thing is sure: With an economic value of nearly $133 billion annually in the U.S., and a growth rate of 4% to 5% each year, packaging is big business. Control Engineering and Packaging Digest set to investigate this dynamic market. The Packaging Automation Benchmark Study, a three-part, year-long research project conducted by Reed Research Group, is designed to deliver a comprehensive view of the state of packaging automation. The study reveals the technology, market and business issues affecting packagers, machine builders, and system integrators. Digital edition of supplement and research study are available
This special packaging automation supplement represents the first of a comprehensive, three-part research project exploring the trends, needs and opportunities across a broad spectrum of packaging-related markets. Here in Volume 1, research results focus on the packagers themselves – who they are, how they do and do not automate, and what obstacles and opportunities they face today and in the future. Volume Two of the Packaging Automation Benchmark Study will focus on packaging machine builders and the state of the market from their standpoint. Survey outreach will begin in late spring 2008 and results will be published in August 2008.
Volume Three will focus on the system integrator community, providing insight into how their interaction with both packagers and machine builders is driving innovation. A key focal point for that study is a view of technology adoption and strategic use of data acquisition. Survey outreach will begin in late fall 2008, with results published in December 2008.
Look also for webcasts, podcasts and other features based on research results. For more information, visit www.controleng.com/automationresearch or www.packagingdigest.com/automationresearch.
Read other articles in the Packaging Automation Benchmark Study, Part 1:
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