ITT Industries, Cannon: Backplane connector ups signal integrity, cuts footprint
By Control Engineering Staff -- Control Engineering, 3/11/2004
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| Direct soldering of daughter card pin stubs into the surface blind holes provides the shortest return path and least amount of crosstalk for Cannon’s new backplane connection technology. |
Need better signal integrity in your backplane connectors? If so, a new connector design from ITT Industries, Cannon might be your answer.
New surface-mount backplane technology (dubbed "Sub-SMT") used in the patent-pending design reportedly reduces backplane-connector footprint to 0.5-mm diameter by 0.5-mm deep plated holes, while improving signal integrity for data transmission rates of 6 Gbps and higher.
Performance is comparable to connectors that require through vias [holes] for mounting and grounding connections. "With a specially shielded design and grounding, the connector technology is able to provide thinner signal pins without reducing impedance control," says Cannon.
Sub-SMT technology uses short pin stubs that fit into solder-paste-filled blind vias instead of more complex press-fit connections. Assembly of the two-part header and daughter card is also said to be simple. After a pick-and-place machine mounts the header, the daughter card pin stubs are soldered directly into the surface blind vias.
—Frank J. Bartos, executive editor, Control Engineering, fbartos@reedbusiness.com
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