Geneva, Switzerland— The International Electrotechnical Commission (IEC) published March 25 four technical specifications (TS) based on IEC 61158. Though the four reports don't mean IEC 61158 has been approved as the long-awaited, long-debated international standard, they do allow IEC to revisit and perhaps revote on IEC 61158 during the next couple of years. Two of the publications address IEC 61158's Data Link Layer and two deal with its Application Layer. Along with the previously standardized Physical Layer, these documents can help users build interoperable devices. IEC's SC65C subcommittee members recommended in January invalidating six "no" votes that sank IEC 61158 last year, and IEC's Committee of Action was expected to consider the recommendation in April.