San Jose, C A - A family of 18 N-channel MOSFETs that combines the thermal performance of much larger devices with very low package resistance, is available in a standard SO-8 package outline (in sample and production quantities). Its so-called 'bottomless' packaging, said to be unique by the manufacturer, allows the MOSFET's solderable backside to directly contact the PCB heat sink, reducing junction-to-case thermal resistance below 0.5 °C/W. It also eliminates wire bonds used in a standard SO-8 package. These new MOSFETs comprise two 150-V, two 200-V, six 40-V, four 20-V, and four 30-V devices. 

Fairchild Semiconductor Intl.  www.fairchildsemi.com