3D and More Machine Vision Technologies
Intelligent Automation Systems (Cambridge, Mass.) demonstrated 4D Imager. This vision system captures three-dimensional information in real time even if the target object is moving. Components of the system include the 4DI sensor head, a personal computer with the 4DI image processing board, and 3D triangulation software. The sensor head consists of a laser projector and multiple CCD imagers. The laser projector applies a series of up to 100 parallel planes of light over the scene without any electromechanical scanning mechanisms. The system runs on Microsoft Windows 95 and outputs either ASCII or IGES format images.
Optigo from CogniTens 3D Vision Systems (Ramat Hasharon, Israel) not only inspects production parts at high speed but also can be used for die verification of complex parts and other prototyping and tooling engineering tasks. CogniTens researchers have developed advanced math formulas and algorithms to make 3D measurements from a series of 2D data. This technique is faster than Moire technology. If high accuracy is desired, Optigo can reach accuracy levels of 50 to 100 microns in just a few minutes of analysis. The system requires standard CCD cameras to capture the image.
Focus Automation Systems (Waterloo, Ontario, Canada) and Toshiba International Corp. (Houston, Tex.) have developed WebScan M71NX, and unpatterened web inspection vision system. Focus Automation contributes parallel pipeline architecture and vision processing engine technology enabling the system to characterize web defects at high speeds. Toshiba developed convolution filter software that detects subtle stains and streaks in optically noisy backgrounds and large area defects.
Using a part of the electromagnetic spectrum beyond the range of the human eye, Nicolet Imaging Systems (San Diego, Calif.) has released its latest Real-Time Failure Analysis System, NXR-20HR. Featuring an 8-micron microfocus X-ray source and 300X maximum magnification, this system is designed to inspect and verify surface-mount technology boards. It identifies hidden defects such as shorted or open solder joints, component misregistration, and voiding or unacceptable size variations in solder bunps.
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