Automated optical inspection: Benchtop system boasts speed, precision
B3 automated optical inspection system for printed circuit boards from YESTech offers a variety of improvements, including faster speed and advanced image processing technology for better defect coverage.
San Clemente, CA —B3 benchtop automated optical inspection system for populated printed circuit boards from YESTech is said to offer up to a 3X improvement in speed over previous versions, and new Fusion Lighting and advanced image processing technology to provide high defect coverage. Equipment is set to debut at the 2007 Apex Printed Circuits Expo in Los Angeles later this month.
B3 features enhanced board handling and software/board set-up compatibility with other YESTech automated optical inspection systems. Programming is reportedly fast and intuitive, with operators typically taking less than 30 min. to create a complete inspection program including solder joints. System uses a standard package library to simplify training and ensure program portability across manufacturing lines. Image processing technology integrates several techniques, including color, normalized correlation and rule-algorithms to provide complete inspection coverage with low false failure rates.
YESTech provides automated optical and high-resolution x-ray inspection systems with integrated yield enhancement solutions for the printed circuit board assembly and advanced semiconductor-packaging industries.
—Control Engineering Daily News Desk
Edited by Jeanine Katzel , senior editor