Linear inductive position sensor for clamping technology

Balluff's BIP linear inductive position sensor is non-contact and has linear travel of 40mm and resolution of 14 microns.


Balluff's BIP linear inductive position is designed for clamping devices for tools and workpieces. Courtesy: BalluffBalluff’s BIP linear inductive position sensor has a measuring principle for position monitoring in applications such as drive spindles and clamping devices for tools and workpieces. The sensor can also be used for other linear motion applications such as punch depth, grab positions, rolling positions, valve positions, etc.

The BIP is non-contact. Linear travel of up to 40 mm can be detected. The Balluff BIP has resolution of 14 microns, repeat accuracy of +/- 80 microns and non linearity of +/- 250 microns for optimal process quality. Available outputs include 0-10 V and 4-20 mA. The sensor’s repeat accuracy allows for process quality, even in cramped locations with temperatures up to 85 C.

Mechanical adjustments are not necessary, allowing the measuring range to be adapted to the application. With the IO-Link Variant this is also possible via the control system. 


- Edited by Chris Vavra, Control Engineering, 

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