Open embedded frame chassis: Don’t get backed into a corner

A new open frame chassis for embedded system test and debugging lacks side or back walls around the card cage area for easy access.


Electronic packaging product manufacturer Elma Electronic announced a new open frame chassis for embedded system test and debugging. Called the E-frame, it lacks side or back walls around the card cage area, leaving it open for easy access. The was designed with the high (and flexible) power and cooling requirements for VPX (


46/48) systems, although any 3U or 6U backplanes will fit. This includes VME/64x, VXS, CompactPCI, and other backplane architectures.
With a rugged modular aluminum construction, the E-frame tower can support up to 21 slots at 0.8 in. or 17 slots at 1 in. pitch. There are front-accessible test points and monitoring LEDs for all VME, VPX, VXS, and cPCI voltages. The unit features high performance cooling with 3 x 150 CFM fans under the card cage speed controlled with fan-fail indication. Other features include a rear ac PEM (Power Entry Module) with fuses, ground stud, front located ESD jacks, and full rear transition module (RTM) support.
C.G. Masi , senior editor
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