System basis chips provide energy efficiency and safety for in-vehicle networks

Freescale's latest generation of automotive certified CAN/LIN devices meet electromagnetic compatibility requirements.

By David Greenfield March 5, 2010

FreescaleSemiconductor has released its next generation of system basis chips (SBCs) whichintegrate an energy management module to power microcontrollers (MCUs),transceiver interfaces to connect with in-vehicle networks, and low-power modesto conserve battery life.

The

MC33904/5S/5D SBCs are built on Freescale SmartMOS technology and are designed

to optimize the performance, power consumption, and cost of electronic control

units for a range of automotive applications. The devices are also suitable for

high-performance body applications such as body controlmodules, lighting

modules, door/seat modules, seatbelt pretensioners, fuel/water pumps, glow plugs,

and low-end engine management systems. They can also be used in applications

including safety and powertrain.

EMC

and electrostatic discharge (ESD) are a serious concern in harsh automotive

environments due to the close proximity of networked electronic systems and

devices. These CAN/LIN-certified devices offer programmable fail-safe features

to assist with system functional safety, while providing a high-level of ESD

protection and EMC performance to address stringent automotive requirements.

The SBCs are AEC-Q100 automotive qualified and are reported to be immune to EMC

and ESD stresses without the need for external components, simplifying the bill

of materials.

Power

management scalability features include:

  • MCU power supply (Vdd):5-volt or 3.3/150mA (with split power option up to 300mA)
  • 5V or 3.3V Vreg forauxiliary loads
  • Dedicated 5V Vreg for CANhigh-speed

Functionalsafety features include:

  • Cranking pulse managementduring low Vdd
  • Fail-EMC safe andconfigurable state machine
  • Enhanced protections anddiagnostics

Energysavings features include:

  • Ultra-low-power modes(typical 15uA with Vdd off)
  • Wake-up management andcyclic sense

Physicallayer features include:

  • Certification to LIN 2.1 andISO 11898-2-5 standards
  • Certification to EMC, ISO,ESD standards

Accessother ControlEngineering content related to energy efficient chips:

  • TIopens advanced manufacturing facility to produce energy -efficient chips
  • AdvancingTechnology: Energy -efficient microchips
  • Embeddedcontrol system reduces small combustion motor emissions

-Edited by DavidGreenfield , editorial director
Control Engineering Sustainable Engineering News Desk