Applications, lifecycle are I/O concerns, Rockwell Automation says
Resolving application-related issues and total cost of ownership are among customers’ I/O-related issues, says Scott Tenorio, marketing manager, control & visualization business, Rockwell Automation.
"Customers’ application requirements are dictating higher levels of precision and accuracy in all sensing functions to ensure consistency and quality of their end products. While machines continue to evolve in complexity, demands for faster speeds, smaller form factors and higher performance are becoming more prevalent to assist efforts in reducing machine size. In addition to solving the application, customers take into consideration the total investment required to acquire, install, configure and maintain the system."
Automation suppliers update and enhance I/O product designs and features to keep pace with the automation technology, Tenorio suggests. "This not only includes enhancing the performance of an individual’s products, but also expands to encompass the overall experience by providing enhanced integration, making it easier to design, commission and maintain a system," he added.
Allen-Bradley 1762 high-density I/O modules from Rockwell Automation
Rockwell Automation I/O offerings include A-B 1762 high density I/O modules. Three new, flexible Allen-Bradley 1762 I/O modules can be used as expansion I/O for Allen-Bradley MicroLogix 1100, MicroLogix 1200 and MicroLogix 1400 controllers. The 1762 modules allow users to add I/O count to applications without having to add an additional rack. The 32-point dc modules are ideal for applications exceeding 144 I/O count. Elimination of the I/O rack from the system can help save costs and reduce replacement parts inventory. The package design allows modules to be DIN-rail or panel mounted. www.ab.com/io
– Edited by Mark T. Hoske, editor in chief, Control Engineering , www.controleng.com.