High-density modules for aerospace applications
TE Connectivity’s (NYSE: TEL) DMC-M high-density 30-23 modules are designed for aerospace applications and achieve higher density with a reverse design that protects against damage due to exposed contacts. The increased density of the 30-position modules provides a 50% increase in contact counts over the existing 20-22 modules, allowing two 30-23 modules to provide the same 60-contact density as three 20-22 modules. TE’s plastic clip technology simplifies the assembly process, providing possible weight savings of up to 20%. The modules are ideal for additional applications such as lighting and window dimming, power distribution and control, and electrical wiring and interconnect systems.
– Edited by CFE Media. See more Control Engineering I/O system and module products.