Molex buys Incep Technologies

Lisle, IL—To emphasize its continued commitment to power-delivery solutions, Molex Inc. reports that it has acquired San Diego-based Incep Technologies Inc.

By Control Engineering Staff September 22, 2004

Lisle, IL— To emphasize its continued commitment to power-delivery solutions, Molex Inc. reports that it has acquired San Diego-based Incep Technologies Inc. Founded in 1998, Incep provides system-level approaches to power delivery, high-density packaging, and thermal management solutions. Financial terms of the transaction were not disclosed.

Molex and Incep have been in a joint development partnership for the past two years. The two companies have focused on developing advanced power-delivery solutions for high-performance semiconductors, such as microprocessors and communication ASICs. Molex plans to incorporate Incep’s assets and programs into its own operations.

Joe King, Molex’s vice chairman and CEO, says acquiring Incep will boost Molex’s market share in power delivery interconnect solutions, and enable it to enter new system-level markets, while continuing it leadership in connector, thermal and manufacturing technologies.

“There is a large opportunity to service the market’s growing need for complete power delivery solutions, from the source to the destination,” adds King. “Major semiconductor manufacturers demand strong, established suppliers who can provide a total solution for their customers. This acquisition gives us an excellent opportunity to strengthen our growing position in power delivery.”

In addition, Incep has established a new standard in the device power-delivery-architecture field, which combines the semiconductor device and its substrates with associated power conditioning circuitry. Incep’s patented technology delivers power to the surface of the device substrate from a voltage regulator mounted over the device through a high-efficiency interconnection system. Incep’s solution also allow use of only one heat-dissipating device and retention solution for the co-packaged device and power supply.

The power and signal-segmentation approach of Incep’s solution reduces device package I/O densities; improves the most demanding transient power performance; frees critical system board space; and offers cost savings to device vendors and system original equipment manufacturers (OEMs). Microelectronic device applications include both microprocessors and communication/networking ASICs.

Molex is a 66-year-old global manufacturer of electronic, electrical and fiber optic interconnection systems. It operates 58 manufacturing facilities in 19 countries.

Control Engineering Daily News Desk
Jim Montague, news editor
jmontague@reedbusiness.com