Open embedded frame chassis: Don’t get backed into a corner

A new open frame chassis for embedded system test and debugging lacks side or back walls around the card cage area for easy access.
By Control Engineering Staff February 28, 2008

Electronic packaging product manufacturer Elma Electronic announced a new open frame chassis for embedded system test and debugging. Called the E-frame, it lacks side or back walls around the card cage area, leaving it open for easy access. The was designed with the high (and flexible) power and cooling requirements for VPX (

VITA

46/48) systems, although any 3U or 6U backplanes will fit. This includes VME/64x, VXS, CompactPCI, and other backplane architectures.
With a rugged modular aluminum construction, the E-frame tower can support up to 21 slots at 0.8 in. or 17 slots at 1 in. pitch. There are front-accessible test points and monitoring LEDs for all VME, VPX, VXS, and cPCI voltages. The unit features high performance cooling with 3 x 150 CFM fans under the card cage speed controlled with fan-fail indication. Other features include a rear ac PEM (Power Entry Module) with fuses, ground stud, front located ESD jacks, and full rear transition module (RTM) support.
C.G. Masi , senior editor
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