Phoenix|x-ray determines BGA opens, improper wetting

Camarillo, Calif. - phoenix|x-ray Systems + Services Inc. introduced the pcba|sentry, a new x-ray inspection system that fills the void between fast automated inline and offline semi-automatic or manual failure analysis systems.

By Gary A. Mintchell, senior editor November 12, 2001

Camarillo, Calif. phoenix|x-ray Systems + Services Inc. introduced the pcba|sentry, a new x-ray inspection system that fills the void between fast automated inline and offline semi-automatic or manual failure analysis systems. The new system is a fully automated microfocus x-ray system for inspection and failure analysis of area array package assembly integrity. In addition to diameter variations, percentage voids, form errors, mis-registrations, pitch, insufficient solder mass the powerful BGA image analysis software repeatedly determines opens and wetting errors instantly at known level of confidence.

Oblique view at high magnification (OVHM) maintains high magnification (1200x) regardless of the angle of tilt or rotation, providing 3D-like imagery with 2D image acquisition speeds. This feature is key to providing the resolution and image quality to see opens, improper wetting, and minute defects in small solder joints found in FBGAs,