Report: Power supply in package, on a chip
Mendham, NJ – Three key pieces of advice from the “2008 Market and Technology Report – Power Supply in a Package – Power Supply on a Chip” follow, according to Joe Horzepa, executive director, Power Sources Manufacturers Association (PSMA) . Such innovations ease integration of power supply and power control technologies into various embedded controls.
– Get smaller . In recent years, power supply miniaturization is being increasingly addressed by semiconductor companies through their ability to deliver advanced processing and functional product formats which are referred to as power supply-in-package (PSiP) and power supply-on-chip (PwrSoC).
– Get i ntegrated . This proliferation of functionally-integrated hardware solutions can be seen as an inflection point in the power supply industry which is seeing a dramatic move away from traditional power supply manufacturing (with a focus on the assembly of power supply modules or bricks from discrete components) to an increasing emphasis on power supply products delivered directly from the semiconductor and microelectronics industries.
– Look for new packages and technologies . This trend is being enabled by advances in semiconductor, magnetic, capacitor and packaging materials and technologies that will deliver products operating at multi-MHz frequencies.
The report presents a summary of the leading suppliers in the industry including their initial product offerings and technical approaches to meet the challenges faced in this evolving new class of products, Horzepa concludes.
The report, ” 2008 Market and Technology Report – Power Supply in a Package – Power Supply on a Chip,” .
– Mark T. Hoske , editor in chief
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