Sensors Expo 2004: Silicon Microstructures launches ultra-small, co-integrated sensors

Milpitas, CA— Using established processes coupled with a continuous improvement program, engineers at Silicon Microstructures Inc. (SMI) have begun production of its SM5108 ultra-small pressure sensor. SM5108 reduces costs to users by etching 24,000 devices on one 6-inch wafer. The rugged 0.65 x 0.65 mm chip is designed for high-volume applications including tire pressure monitoring, engine control, barometric pressure sensing, handheld meters, and home appliances.

SMI has also readied its SM5201 co-integrated sensor, which uses recent design advances to combine CMOS/EEPROM signal conditioning with pressure sensing on one chip for high performance. The benefits of using SMI’s co-integration method include smaller size, reduced cost, higher reliability, and tighter accuracy through multi-order temperature and pressure compensation.

Also, SMI’s new Alcatel DRIE machine,

SMI exhibited its new products at Sensors Expo 2004, June 8-10, in Detroit, MI.

Control Engineering Daily News DeskElizabeth SanFilippo, editorial internelizabeth.sanfilippo@reedbusiness.com

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