ITT Industries, Cannon: Backplane connector ups signal integrity, cuts footprint

Need better signal integrity in your backplane connectors? If so, a new connector design from ITT Industries, Cannon might be your answer.


Direct soldering of daughter card pin stubs into the surface blind holes provides the shortest return path and least amount of crosstalk for Cannon’s new backplane connection technology.

Need better signal integrity in your backplane connectors? If so, a new connector design from ITT Industries, Cannon might be your answer.

New surface-mount backplane technology (dubbed "Sub-SMT") used in the patent-pending design reportedly reduces backplane-connector footprint to 0.5-mm diameter by 0.5-mm deep plated holes, while improving signal integrity for data transmission rates of 6 Gbps and higher.

Performance is comparable to connectors that require through vias [holes] for mounting and grounding connections. "With a specially shielded design and grounding, the connector technology is able to provide thinner signal pins without reducing impedance control," says Cannon.

Sub-SMT technology uses short pin stubs that fit into solder-paste-filled blind vias instead of more complex press-fit connections. Assembly of the two-part header and daughter card is also said to be simple. After a pick-and-place machine mounts the header, the daughter card pin stubs are soldered directly into the surface blind vias.

—Frank J. Bartos, executive editor, Control Engineering,

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