Microchip Technology: Smaller packages for PIC microcontrollers

New 4x4-mm QFN (quad flat, no-lead) package options for Microchip Technology Inc.’s popular mid-range (x14 architecture) PIC microcontrollers were recently announced in 8-, 14- and 20-pin configurations.


Embedded Control

PIC16F690 is one of Microchip Technology’s microcontrollers with new 4x4mm QFN package option.

New 4x4-mm QFN (quad flat, no-lead) package options for Microchip Technology Inc. ’s popular mid-range (x14 architecture) PIC microcontrollers were recently announced in 8-, 14- and 20-pin configurations. These low-pin count package options are designed to accommodate a variety of space-constrained applications, such as dc/dc point-of-load (POL) converters and handheld consumer electronics, says the company.

Reportedly 50–70% smaller than SOIC (small-outline integrated circuit) and SSOP (shrink small-outline package) versions, Microchip offers these 4x4-mm PIC microcontrollers (MCUs) in response to the need faced by many embedded engineers to squeeze applications into ever-smaller spaces. “Our customers are continuously asking for higher featured devices in increasingly smaller packages,” says Steve Drehobl, VP of Microchip’s Security, Microcontroller and Technology Development Division.

Initially, 14 microcontrollers are being offered in the QFN package version. These MCUs also incorporate Microchip’s nanoWatt Technology features for greater control over power consumption in the device.

—Frank J. Bartos, executive editor, Control Engineering, fbartos@reedbusiness.com

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