Sensors: Fab delivers world’s largest flexible photosenisitive array

Nanoident Technologies AG, manufacturer of printed-semiconductor-based optoelectronic sensors, delivered the world’s largest printed semiconductor-based photodetector array on a flexible polyethylene terephthalate foil substrate.

05/29/2007


Linz, Austria Nanoident Technologies AG , manufacturer of printed-semiconductor-based optoelectronic sensors, delivered the world’s largest printed semiconductor-based photodetector array on a flexible polyethylene terephthalate (PET) foil substrate. An industry first, this array was developed with the Nanoident Semiconductor 2.0 platform and manufactured at the Nanoident Organic Fab (OFAB). The company says that, with this process, OEM partners can realize application-specific, cost-effective, printed semiconductor-based photodetector arrays that eliminate the need for costly optical filters and can be used in a wide variety of new industrial, medical and security applications.


Nanoident has produced the world’s largest photosensitive array on a flexible plastic (PET) substrate. Source: Nanoident

“One of our industrial customers came to [us] requesting a radical new photodetector array design for a specific industrial application that could not be delivered with silicon,” said Nanoident CEO Klaus Schroeter. “Working together, we were able to deliver the industry’s first large-area array on a flexible substrate that includes specific spectral sensitivity and meets other application-specific requirements. We are excited to deliver this solution, which will transform existing test processes as well as create an entirely new application for the industrial market.”

The Nanoident Semiconductor 2.0 platform serves as the core technology foundation for a wide array of application-specific printed semiconductor platforms and products. With its platform, Nanoident was able to manufacture a large-area photodetector array by depositing thin layers of conducting and semiconducting “inks” onto a plastic foil substrate using state-of-the-art printing techniques. By using printed semiconductor-based technology, which provides unique mechanical, electro-optical and structural properties, the company was able to deliver an 18 x 12 cm array, and says it could easily produce detectors up to 50 x 50 cm or larger. With large-area, ultra-thin, flexible devices that incorporate application specific spectral properties, customers are able to eliminate expensive optical filters and develop an entirely new class of application types. Applications for large-area photodetector arrays include industrial measurement and test, medical imaging and security screening.

Nanoident’s Semiconductor 2.0 platform is comprised of four core intellectual property (IP) elements: liquid conductive and semiconductive materials, design and simulation, production processes, and quality assurance and functional component IP. It enables design and mass production of printed-semiconductor-based functional components, such as photo detectors, light emitting diodes, transistors, resistors, capacitors and interconnects. With Nanoident’s printed semiconductor production process, devices can also be manufactured in hours rather than weeks.

Nanoident says its high speed, environmentally friendly manufacturing process utilizes liquid nanomaterials and additive production techniques. These liquids are used to print electronic circuits on a wide variety of surfaces, producing products in mere hours for prototype as well as high volume applications. The company’s printed semiconductor devices can be bendable, disposable, light, ultra thin and of large-area. They have application specific spectral and electronic properties, and can contain light sources and light detectors as well as electronic circuits. These unique characteristics enable cost effective, custom designed devices for applications such as industrial, chemical, biological, biometric and X-ray sensors, printed OLED displays for smart packaging and electronic signage.

—Edited by C.G. Masi , senior editor, Control Engineering Weekly News
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