Vicor’s V-I chip sets power density record

Andover, MA— Vicor Corp. reports that the newest member of its V-I Chip Bus Converter Module (BCM) family, B048K480T30, provides 2,250 V dc primary-to-secondary isolation with a unity transformation ratio (K = 1) over the input range of 38-55 V dc. Rated for 300 W and with an efficiency of 97%, this BCM reportedly sets new industry standards for power density and performance in power-over-Ethernet (PoE) and voice-over-IP (VoIP) applications and other applications requiring isolation from a 48 V dc source.

Vicor adds that its new V-I Chip sets a new record for power density at 1,167 W per cubic inch. It may be surface mounted into the PCB with a profile as low as 0.16 in., for an effective power density of 1,750 W per cubic inch, or on the board with an overall height of 0.25 in., for a power density of 1,095 W per cubic inch.

V-I Chip’s power package is available with BGA or J-leads and is fully compatible with standard surface mount manufacturing processes. The chip’s high efficiency and thermally adept package enables the full 300-W capability to be realized at 65 °C, 300 LFM without a heat sink. With a 0.25-in. high integral pin fin heat sink, full load is available at 75 °C, 200 LFM.

‘This new V-I Chip sets new records, breaking through the 1,000 W per cubic inch barrier, eclipsing the best bricks that are less than 200 W per cubic inch, and delivering, not only the highest power density, but also the best efficiency,” says Andrew Hilbert, Vicor’s senior product marketing director. “What’s more, its extremely fast response time and very low noise greatly reduces, or even eliminates, the need for bulk capacitance and other filtering components, resulting in additional savings in board area, materials and total system cost.’

Control Engineering Daily News Desk
Jim Montague, news editor
jmontague@reedbusiness.com

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