Fast, low-power SBC

Eurocom 400 CPU from American Eltec features the new dual-core Intel Xeon processor LV 2.0 GH with dual CPU capabilities in combination with the COM Express platform, the PICMG-defined form factor for computers-on-modules that replaces the ETX standard.

By Control Engineering Staff September 18, 2006

Eurocom 400 CPU from American Eltec features the new dual-core Intel Xeon processor LV 2.0 GH with dual CPU capabilities in combination with the COM Express platform, the PICMG-defined form factor for computers-on-modules that replaces the ETX standard. Processor and chip set offers the high performance of Intel’s dual core Xeon processor with the low-power consumption of the Eltec CPU at 31 W. The Eurocom 400 uses the Intel E7520 chipset, which provides a basis on the COM express module for higher system performance in combination with the 8-lane PCI Express connection to the carrier board. Module architecture enables fast data transfer simultaneously on multiple channels. Up to 4 GBytes of RAM can be implemented. Combination of graphics and server performance can support many industrial applications.

www.americaneltec.com

American Eltec Inc.