New wafer-level burn-in cuts costs, cycle time

W. L. Gore and Associates Inc. recently launched two new products expected to reduce costs and accelerate production cycle times by about 25% each. Targeted at the semiconductor test market, GoreMate wafer contactors and Inferno wafer probe interconnect boards were developed to simultaneously contact all die on a 200 mm wafer during the burn-in cycle of the full wafer.

By Staff November 1, 1998

Elkton, Md. W. L. Gore and Associates Inc. recently launched two new products expected to reduce costs and accelerate production cycle times by about 25% each. Targeted at the semiconductor test market, GoreMate wafer contactors and Inferno wafer probe interconnect boards were developed to simultaneously contact all die on a 200 mm wafer during the burn-in cycle of the full wafer.

The two products are critical to the implementation of Wafer Level Burn-in (WLBI) technology on a broad scale across the semiconductor industry. They were developed in conjunction with Motorola, which supplied semiconductors, and Tokyo Electron Limited (TEL) as the test equipment integrator.

TEL, Gore, and Motorola’s three-year project could help Motorola become the first semiconductor manufacturer to implement wafer-level burn-in technology on production devices without additional process steps. The WLBI process forces early failures in marginal and defective devices before packaging and final test.

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